Researchers Developed Hydrogenated Diamond Circuit


Researchers developed hydrogenated diamond circuit that can operate at 300 degree Celsius, according to a study conducted on April 10, 2018.

The fabrication of hydrogenated diamond circuit in power conversion systems was developed by researchers from Japan. Also, this circuit can function at temperatures as high as 300 degrees Celsius. These circuits can be used in diamond-based electronic devices that are smaller, lighter and more efficient, as compared to silicon-based devices.

Silicon is a poor choice for circuits in high-power, high-temperature, and high-frequency electronic devices, owing to its material properties. For high-power generators, diamond is suitable, as it is small in size and power loss is less. In this study, an H-diamond NOR logic circuit’s stability at high temperatures was tested by the researchers. An output is given by the circuit when both the inputs are zero. Two metal-oxide-semiconductor field-effect transistors (MOSFETs), which are used in many electronic devices and in digital integrated circuits such as microprocessors was present in the circuit.

Although the circuit functioned properly at 300 degree Celsius, when the temperature was increased to 400 degree Celsius, the circuit failed. Researchers suspect that MOSFETs broke down due to the higher temperature. The maximum operation temperature for silicon-based electronic devices is only up to150 degrees. By altering the oxide insulators and modifying the fabrication process, researchers are planning to improve stability of the circuit at high temperatures. They are expecting construction of H-diamond MOSFET logic circuits that can operate above 500 degrees Celsius and at 2.0 kilovolts.

Yasuo Koide, director at the National Institute for Materials Science and co-author of the paper said, “Diamond is one of the candidate semiconductor materials for next-generation electronics, specifically for improving energy savings. Of course, in order to achieve industrialization, it is essential to develop inch-sized single-crystal diamond wafers and other diamond-based integrated circuits.”